- All sections
- B - Performing operations; transporting
- B22F - Working metallic powder; manufacture of articles from metallic powder; making metallic powder; apparatus or devices specially adapted for metallic powder
- B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
Patent holdings for IPC class B22F 1/05
Total number of patents in this class: 374
10-year publication summary
0
|
0
|
3
|
3
|
15
|
23
|
50
|
77
|
122
|
61
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Hewlett-Packard Development Company, L.P. | 28538 |
19 |
Seiko Epson Corporation | 18724 |
15 |
Dowa Electronics Materials Co., Ltd. | 610 |
12 |
JFE Steel Corporation | 6067 |
10 |
Höganäs AB | 337 |
8 |
ArcelorMittal | 1887 |
6 |
Betek GmbH & Co. KG | 140 |
6 |
Fukuda Metal Foil & Powder Co., Ltd. | 66 |
5 |
Oerlikon Metco (US) Inc. | 202 |
5 |
Proterial, Ltd. | 638 |
5 |
Murata Manufacturing Co., Ltd. | 22355 |
4 |
TDK Corporation | 6306 |
4 |
Materion Corporation | 293 |
4 |
Metal Powder Works, LLC | 6 |
4 |
Taniobis GmbH | 68 |
4 |
JX Metals Corporation | 111 |
4 |
General Electric Company | 18133 |
3 |
Honda Motor Co., Ltd. | 24537 |
3 |
The Boeing Company | 19843 |
3 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
3 |
Other owners | 247 |